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Thermomigration in SnPb composite flip chip solder joints
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10.1063/1.2192694
/content/aip/journal/apl/88/14/10.1063/1.2192694
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/14/10.1063/1.2192694
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(Color online) (a) Schematic picture of a flip chip sample, (b) schematic diagram of the cross section of a composite flip chip solder joint, and (c) schematic picture of half row of sample and ac direction.

Image of FIG. 2.
FIG. 2.

(Color online) Composite flip chip solder bumps (a) before aging and (b) after aging at for and (c) after thermomigration.

Image of FIG. 3.
FIG. 3.

(Color online) (a) Schematic diagram of 24 solder bumps from right to left at the peripheral of a chip with four pairs of solder bumps under current stressing, and (b) SEM micrographs of the cross section of the solder bumps at peripheral of composite flip chip sample after bump pair 10 and 11 failed after of current stressing at at .

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/content/aip/journal/apl/88/14/10.1063/1.2192694
2006-04-04
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermomigration in SnPb composite flip chip solder joints
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/14/10.1063/1.2192694
10.1063/1.2192694
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