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(Color online) (a) Schematic picture of a flip chip sample, (b) schematic diagram of the cross section of a composite flip chip solder joint, and (c) schematic picture of half row of sample and ac direction.
(Color online) Composite flip chip solder bumps (a) before aging and (b) after aging at for and (c) after thermomigration.
(Color online) (a) Schematic diagram of 24 solder bumps from right to left at the peripheral of a chip with four pairs of solder bumps under current stressing, and (b) SEM micrographs of the cross section of the solder bumps at peripheral of composite flip chip sample after bump pair 10 and 11 failed after of current stressing at at .
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