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Improved barrier properties of ultrathin Ru film with TaN interlayer for copper metallization
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10.1063/1.2195112
/content/aip/journal/apl/88/15/10.1063/1.2195112
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/15/10.1063/1.2195112
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Sheet resistance variation with the annealing temperatures for the , , and samples.

Image of FIG. 2.
FIG. 2.

XRD spectra of the samples annealed at different temperatures for .

Image of FIG. 3.
FIG. 3.

AES depth profiles of the samples annealed at (a) and (b) for .

Image of FIG. 4.
FIG. 4.

XRD spectra of the samples annealed at (a) and (b) . For comparison, an XRD spectrum of the sample annealed at for was also shown in (c).

Image of FIG. 5.
FIG. 5.

XTEM images for the samples annealed at (a) and (b) for .

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/content/aip/journal/apl/88/15/10.1063/1.2195112
2006-04-12
2014-04-16
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Improved barrier properties of ultrathin Ru film with TaN interlayer for copper metallization
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/15/10.1063/1.2195112
10.1063/1.2195112
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