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Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications
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10.1063/1.2202129
/content/aip/journal/apl/88/19/10.1063/1.2202129
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/19/10.1063/1.2202129
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Cross sectional SEM images of the BZN thin films deposited at (a) and (b) of an oxygen pressure on the copper coated Si substrate. (c) dielectric constant vs frequency measured at and (d) leakage current density vs applied voltage of the BZN thin films as a function of an oxygen partial pressure. Copper was coated on a thick Ti buffer layer to improve the adhesion between copper and Si substrate.

Image of FIG. 2.
FIG. 2.

(A) Dielectric properties of the BZN thin films annealed at different temperatures. The BZN films were deposited at . Capacitance vs voltage curves were developed with dc biases ranging from with an oscillator amplitude of and a frequency. The lines are guides for eyes. (B) Leakage current density vs applied voltage of (a) as deposited and postannealed at (b) , (c) , and (d) . The film thicknesses are about .

Image of FIG. 3.
FIG. 3.

(A) XPS surface spectra of (a) as-deposited and postannealed at (b) and (c) BZN thin films. (B) Raman spectra of (a) the as-deposited and (b) postannealed at BZN thin films. (C) Plan view TEM images of (a) as-deposited and (c) postannealed BZN thin films at in air; (b) and (d) are SAD patterns taken from (a) and (c), respectively.

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/content/aip/journal/apl/88/19/10.1063/1.2202129
2006-05-09
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/19/10.1063/1.2202129
10.1063/1.2202129
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