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Thin-film adhesion measurement using laser-generated high-power surface acoustic wave
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10.1063/1.2203205
/content/aip/journal/apl/88/19/10.1063/1.2203205
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/19/10.1063/1.2203205
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

A schematic diagram of the experimental setup is shown. The pump laser beam reflects from dichroic mirror (DM) and is focused by the microscope objective lens. The Michelson interferometer includes the sample surface, reference mirror M2, and beam splitter BS2. Failure is observed by the CCD camera.

Image of FIG. 2.
FIG. 2.

Detector signal (bottom line) and normal free surface velocity (line with symbols) for the Cu film on glass substrate. Film thickness is .

Image of FIG. 3.
FIG. 3.

Calculated free surface velocities (solid thick line), normal stress (triangles), and shear stress (circles) for the copper film on the glass substrate based on experimental measurements. Dashed line shows the normal stress calculated from Eq. (5). The film thickness is (a) and (b) .

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/content/aip/journal/apl/88/19/10.1063/1.2203205
2006-05-10
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thin-film adhesion measurement using laser-generated high-power surface acoustic wave
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/19/10.1063/1.2203205
10.1063/1.2203205
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