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Noncontact dielectric constant metrology of low- interconnect films using a near-field scanned microwave probe
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View: Figures


Image of FIG. 1.
FIG. 1.

Apparatus schematic and the lumped element scheme for the tip impedance in the case of a thin dielectric film on an arbitrary substrate. Tip-sample distance ; tip size .

Image of FIG. 2.
FIG. 2.

(a) 2D finite element model simulations of the normalized frequency shift for a -thick film on a metallic substrate at three tip-sample distances , 225, and . The tip geometry is shown in Fig. 1. It is evident that is linear (within simulation precision ) at . For these simulations . Solid lines are guides to the eye. (b) Typical experimental dependence for vs obtained on a set of six films, the parallel plate capacitor model , and the results of 2D simulation. The solid lines are guides to the eye. Note that in this graph is not absolute but is measured relative to , which was determined by extrapolating the experimental data to .

Image of FIG. 3.
FIG. 3.

(a) Correlation between NSMP and Hg probe measurements on log-log scale for a number of low- and high- films. The solid line is the linear fit with correlation coefficient . (b) Histogram based on 100 measurements performed at the same site on an -thick low- film. Mean -value is 3.237, with a standard deviation of 0.29%.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Noncontact dielectric constant metrology of low-k interconnect films using a near-field scanned microwave probe