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Implantation assisted copper diffusion: A different approach for the preparation of junction
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10.1063/1.2219135
/content/aip/journal/apl/89/1/10.1063/1.2219135
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219135

Figures

Image of FIG. 1.
FIG. 1.

XRD patterns of unimplanted, implanted, IC, and UC samples.

Image of FIG. 2.
FIG. 2.

Absorption spectra of copper diffused and pure samples. vs graph of sample IC is shown in the inset.

Image of FIG. 3.
FIG. 3.

Cell characteristics of the best cell obtained (C4). Characteristics of cell ICJ is depicted in the inset.

Tables

Generic image for table
Table I.

RBS analysis of samples UC and IC.

Generic image for table
Table II.

Comparison of cell parameters of different cells prepared.

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/content/aip/journal/apl/89/1/10.1063/1.2219135
2006-07-07
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Implantation assisted copper diffusion: A different approach for the preparation of CuInS2∕In2S3p-n junction
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219135
10.1063/1.2219135
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