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Thermal stress evolution in embedded Cu/low- dielectric composite features
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10.1063/1.2219727
/content/aip/journal/apl/89/1/10.1063/1.2219727
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219727
/content/aip/journal/apl/89/1/10.1063/1.2219727
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/content/aip/journal/apl/89/1/10.1063/1.2219727
2006-07-07
2014-07-28
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal stress evolution in embedded Cu/low-k dielectric composite features
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219727
10.1063/1.2219727
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