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Thermal stress evolution in embedded Cu/low- dielectric composite features
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10.1063/1.2219727
/content/aip/journal/apl/89/1/10.1063/1.2219727
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219727
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Cross-sectional schematic geometry of representative volume element of Cu features, with thickness and length , embedded in SiCOH on a Si substrate.

Image of FIG. 2.
FIG. 2.

Stress evolution during thermal cycling of Cu features in SiCOH. X-ray diffraction measurements taken at temperature (solid line) and at room temperature (dotted line).

Image of FIG. 3.
FIG. 3.

Stress evolution during thermal cycling of Cu features in SiCOH. X-ray diffraction measurements taken at temperature (solid line) and at room temperature (dotted line).

Image of FIG. 4.
FIG. 4.

Comparison of change in the elastic stress of the Cu features as a function of normalized feature width to values predicted by FEM.

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/content/aip/journal/apl/89/1/10.1063/1.2219727
2006-07-07
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal stress evolution in embedded Cu/low-k dielectric composite features
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/1/10.1063/1.2219727
10.1063/1.2219727
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