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In situ transmission electron microscopy observations of and Cu interconnects under thermal stresses
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10.1063/1.2360240
/content/aip/journal/apl/89/15/10.1063/1.2360240
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2360240
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

TEM images of CI samples in plan view (a) and (b) , and cross-section view (c) and (d) .

Image of FIG. 2.
FIG. 2.

Nucleation of dislocations at Cu grain boundary in lines at . The white arrows indicate dislocations, which moved away upon nucleation.

Image of FIG. 3.
FIG. 3.

Void formation at triple point in lines at .

Image of FIG. 4.
FIG. 4.

[(a)–(e)] Sequence of TEM images showing void growth during in situ heating.

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/content/aip/journal/apl/89/15/10.1063/1.2360240
2006-10-13
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: In situ transmission electron microscopy observations of 1.8μm and 180nm Cu interconnects under thermal stresses
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2360240
10.1063/1.2360240
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