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In situ transmission electron microscopy observations of and Cu interconnects under thermal stresses
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10.1063/1.2360240
/content/aip/journal/apl/89/15/10.1063/1.2360240
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2360240
/content/aip/journal/apl/89/15/10.1063/1.2360240
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/content/aip/journal/apl/89/15/10.1063/1.2360240
2006-10-13
2014-11-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: In situ transmission electron microscopy observations of 1.8μm and 180nm Cu interconnects under thermal stresses
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2360240
10.1063/1.2360240
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