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Thermionic cooling in cylindrical semiconductor nanostructures
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10.1063/1.2361263
/content/aip/journal/apl/89/15/10.1063/1.2361263
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2361263
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematics for thermionic cooling in cylindrical semiconductor nanostructures with the outer cylinder as the cold electrode.

Image of FIG. 2.
FIG. 2.

Cooling efficiency of cylindrical structures (with the outer cylinder as the cold electrode) vs the applying voltage at a fixed radius of the inner cylinder (a) and at a fixed width of barrier (b).

Image of FIG. 3.
FIG. 3.

Threshold voltage vs the radius of the inner cylinder at several fixed widths of the barrier.

Image of FIG. 4.
FIG. 4.

Cooling efficiency of cylindrical structures (with the outer cylinder as the cold electrode) vs the radius of the inner cylinder at several fixed barrier widths.

Image of FIG. 5.
FIG. 5.

Cooling efficiency of cylindrical structures (with the outer cylinder as the hot electrode) vs the radius of the inner cylinder at several fixed barrier widths.

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/content/aip/journal/apl/89/15/10.1063/1.2361263
2006-10-12
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermionic cooling in cylindrical semiconductor nanostructures
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2361263
10.1063/1.2361263
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