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Thermionic cooling in cylindrical semiconductor nanostructures
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10.1063/1.2361263
Pin Lyu1 and Chao Zhang1,a)
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Affiliations:
1 School of Engineering Physics, University of Wollongong, New South Wales 2522, Australia
a) Electronic mail: czhang@uow.edu.au
Appl. Phys. Lett. 89, 153125 (2006)
/content/aip/journal/apl/89/15/10.1063/1.2361263
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/15/10.1063/1.2361263
View: Figures

## Figures

FIG. 1.

Schematics for thermionic cooling in cylindrical semiconductor nanostructures with the outer cylinder as the cold electrode.

FIG. 2.

Cooling efficiency of cylindrical structures (with the outer cylinder as the cold electrode) vs the applying voltage at a fixed radius of the inner cylinder (a) and at a fixed width of barrier (b).

FIG. 3.

Threshold voltage vs the radius of the inner cylinder at several fixed widths of the barrier.

FIG. 4.

Cooling efficiency of cylindrical structures (with the outer cylinder as the cold electrode) vs the radius of the inner cylinder at several fixed barrier widths.

FIG. 5.

Cooling efficiency of cylindrical structures (with the outer cylinder as the hot electrode) vs the radius of the inner cylinder at several fixed barrier widths.

/content/aip/journal/apl/89/15/10.1063/1.2361263
2006-10-12
2014-04-19

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