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Contact transfer of aligned carbon nanotube arrays onto conducting substrates
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10.1063/1.2356899
/content/aip/journal/apl/89/16/10.1063/1.2356899
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/16/10.1063/1.2356899
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Figures

Image of FIG. 1.
FIG. 1.

(Color online) Scheme for the contact printing of CNT bundles on gold-tin solder surface. (a) SEM image of CNT bundles grown on pattern by CVD methods. (b) Solder surface after transferring the CNT bundles shown in (a). Inset of (b) shows higher magnification of CNTs on gold-tin solder.

Image of FIG. 2.
FIG. 2.

(Color online) [(a) and (b)] SEM images of CNTs transferred onto solder pads (positive pattern) using Scheme 2. (c) CNTs transferred between the solder pads (negative pattern) using Scheme 3. (d) Microraman spectra of the CNTs before and after transfer.

Image of FIG. 3.
FIG. 3.

(a) The emission current vs voltages plot for the MWCNT on solder substrate. Inset of (a) is the typical configuration for field emission measurement. (b) Field emission currents as a function of time. Inset of (b) is the Fowler-Nordheim plot of field emission. Solid line is the linear fit to the data.

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/content/aip/journal/apl/89/16/10.1063/1.2356899
2006-10-19
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Contact transfer of aligned carbon nanotube arrays onto conducting substrates
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/16/10.1063/1.2356899
10.1063/1.2356899
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