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Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy
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10.1063/1.2425040
/content/aip/journal/apl/89/26/10.1063/1.2425040
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/26/10.1063/1.2425040
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Cross-sectional schematic diagram of the samples used in this study.

Image of FIG. 2.
FIG. 2.

(a) Plan-view x-ray image of the joint before current stressing. The UBM and passivation openings were labeled by the dotted white circles. (b) X-ray image of the same joint after current stressing. The void was enclosed by the white line. (c) X-ray image of the same joint after being polished laterally to middle of the joint. (d) Cross-sectional SEM image of the joint in (c). A void formed near the entrance of the Al trace.

Image of FIG. 3.
FIG. 3.

Plan-view x-ray images of the joint after stressing for (a) , (b) , (c) , and (d) . The position of the Al trace was labeled by the dotted lines in the figures.

Image of FIG. 4.
FIG. 4.

Corresponding cross-sectional SEM images of the joint in Figs. 3(a)–3(d).

Image of FIG. 5.
FIG. 5.

(a) Plot of depletion area as a function of stressing time. (b) Plot of void growth velocity against stressing time for the five samples. The depletion percentage of UBM opening for each sample was also shown in the figure.

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/content/aip/journal/apl/89/26/10.1063/1.2425040
2006-12-27
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy
http://aip.metastore.ingenta.com/content/aip/journal/apl/89/26/10.1063/1.2425040
10.1063/1.2425040
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