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Electromigration-induced Kirkendall voids at the interface in flip-chip joints
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10.1063/1.2714100
/content/aip/journal/apl/90/11/10.1063/1.2714100
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/11/10.1063/1.2714100
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic diagram of the structure of the experimental flip-chip pure Sn solder bump.

Image of FIG. 2.
FIG. 2.

FIB images on Sn/rolled Cu interfaces annealed at for .

Image of FIG. 3.
FIG. 3.

SEM cross-sectional images of both anode and cathode interfaces of Sn bumps after of current stressing.

Image of FIG. 4.
FIG. 4.

FIB image at the cathode interface after of current stressing.

Image of FIG. 5.
FIG. 5.

Schematic diagram of the net Cu flux along the electron flow at the anode interface.

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/content/aip/journal/apl/90/11/10.1063/1.2714100
2007-03-16
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/11/10.1063/1.2714100
10.1063/1.2714100
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