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Electromigration-induced Kirkendall voids at the interface in flip-chip joints
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10.1063/1.2714100
/content/aip/journal/apl/90/11/10.1063/1.2714100
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/11/10.1063/1.2714100
/content/aip/journal/apl/90/11/10.1063/1.2714100
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/content/aip/journal/apl/90/11/10.1063/1.2714100
2007-03-16
2014-10-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/11/10.1063/1.2714100
10.1063/1.2714100
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