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Schematic diagram of the structure of the experimental flip-chip pure Sn solder bump.
FIB images on Sn/rolled Cu interfaces annealed at for .
SEM cross-sectional images of both anode and cathode interfaces of Sn bumps after of current stressing.
FIB image at the cathode interface after of current stressing.
Schematic diagram of the net Cu flux along the electron flow at the anode interface.
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