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Wafer-level microelectromechanical system structural material test by electrical signal before pull-in
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10.1063/1.2714998
/content/aip/journal/apl/90/12/10.1063/1.2714998
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/12/10.1063/1.2714998

Figures

Image of FIG. 1.
FIG. 1.

(Color online) SEM pictures of the finished fixed-fixed beam sample.

Image of FIG. 2.
FIG. 2.

(Color online) Typical trend of the capacitance variations to the applied bias voltages.

Image of FIG. 3.
FIG. 3.

(Color online) Typical converging trend of the extracted Young’s modulus and residual stress.

Tables

Generic image for table
Table I.

Parameters of the aluminum test beams.

Generic image for table
Table II.

Extracted Young’s modulus and residual stress of the sputtered aluminum.

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/content/aip/journal/apl/90/12/10.1063/1.2714998
2007-03-21
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Wafer-level microelectromechanical system structural material test by electrical signal before pull-in
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/12/10.1063/1.2714998
10.1063/1.2714998
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