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Coefficient of thermal expansion and biaxial elastic modulus of phase tantalum thin films
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10.1063/1.2734468
/content/aip/journal/apl/90/18/10.1063/1.2734468
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/18/10.1063/1.2734468

Figures

Image of FIG. 1.
FIG. 1.

Stress vs temperature data for (a) a Ta film deposited in the phase on a (100) Si substrate and (b) a Ta film deposited in the phase on a fused silica substrate. The large increase in stress near during heating in both films is due to densification during the phase transformation (see Ref. 14). Linear fits to the data below are shown by the solid lines and represent thermoelastic slopes.

Tables

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Table I.

Comparison of thermoelastic slopes measured for as-deposited and phase-transformed films on (100) silicon and amorphous fused silica substrates.

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Table II.

CTEs and biaxial elastic moduli calculated from data in Table I for as-deposited and phase-transformed films. The CTE (see Ref. 19) and the biaxial elastic moduli calculated from single crystal elastic constants (see Ref. 20) for bulk bcc films having (100), (111), and (211) fiber textures are given for comparison.

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/content/aip/journal/apl/90/18/10.1063/1.2734468
2007-05-01
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Coefficient of thermal expansion and biaxial elastic modulus of β phase tantalum thin films
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/18/10.1063/1.2734468
10.1063/1.2734468
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