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Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy
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10.1063/1.2740109
/content/aip/journal/apl/90/20/10.1063/1.2740109
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/20/10.1063/1.2740109
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

TEM images of a Cu (111)-oriented grain and the corresponding SAED patterns at different stages during electrical current stressing.

Image of FIG. 2.
FIG. 2.

Dark field image obtained from the forbidden reflections for the inspected Cu (111) grain in an electrically stressed Cu line and the corresponding SAED patterns.

Image of FIG. 3.
FIG. 3.

(a) Schematic diagram of the atomic migration path for Cu atoms on (111) crystal planes and (b) the cross-sectional view of the Cu (111) crystal planes.

Image of FIG. 4.
FIG. 4.

High-resolution TEM images of Cu atoms on the crystal planes in the stressed Cu line as a function of time. The high-resolution TEM images were analyzed by fast Fourier transform techniques. The labeled arrows indicate the atomic surface steps on the Cu crystal planes. The cross refers to a fixed point for ease of inspection.

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/content/aip/journal/apl/90/20/10.1063/1.2740109
2007-05-14
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/20/10.1063/1.2740109
10.1063/1.2740109
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