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(a) Schematic drawing of the proposed polymeric thermal actuator, consisting of a symmetrically meandering silicon (Si) microstructure, SU-8 encapsulant, and an aluminum (Al) heater, together with a representative unit cell of three layers (Si/SU-8/Si). (b) The measured tip displacement for a sample device (, , and , and ) as a function of input power when electrically activated by the aluminum heater ( thick).
Microscope images showing full and partial views of the micromachined devices: (a) a scanning electron micrograph of a sample device still residing on silicon substrate (, , and ); (b) An optical image of a polymeric actuator with wide meandering silicon microstructure; (c) an optical image of a polymeric actuator with wide parallel plates.
Trends of the apparent transverse CTE (top) and the blocked transverse stress (bottom) with respect to the aspect ratio of the layer width to the spacing between the layers, for two polymeric composite designs: (i) embedded with parallel silicon plates or (ii) embedded with meandering silicon microstructures.
Comparison of thermal expandable materials.
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