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Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints
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10.1063/1.2743395
/content/aip/journal/apl/90/21/10.1063/1.2743395
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/21/10.1063/1.2743395

Figures

Image of FIG. 1.
FIG. 1.

(Color online) Three-dimensional schematic diagram of a pair of solder bumps interconnected by a dog-bone-type Al stripe on top of them.

Image of FIG. 2.
FIG. 2.

Cross-sectional SEM picture of solder bump after (a) current stressing for and (b) current stressing for at .

Image of FIG. 3.
FIG. 3.

(Color online) (a) Enlarged cross-sectional SEM picture in the anode of Al line under current stressing of for . (b) Enlarged cross-sectional SEM picture in the cathode of Al line. (c) Enlarged cross-sectional SEM picture of the left-upper region in the anode of Al line.

Image of FIG. 4.
FIG. 4.

Relationship between maximum temperature of bumps and resistance change of Al line. For a current density of , when the resistance of the Al line changed doubled, maximum temperature of the solder bump reached . For current density of , was reached when the resistance of the Al line increases by a factor of 3.

Tables

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Table I.

Experimental conditions of eutectic SnPb solder at .

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/content/aip/journal/apl/90/21/10.1063/1.2743395
2007-05-24
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/21/10.1063/1.2743395
10.1063/1.2743395
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