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(Color online) Three-dimensional schematic diagram of a pair of solder bumps interconnected by a dog-bone-type Al stripe on top of them.
Cross-sectional SEM picture of solder bump after (a) current stressing for and (b) current stressing for at .
(Color online) (a) Enlarged cross-sectional SEM picture in the anode of Al line under current stressing of for . (b) Enlarged cross-sectional SEM picture in the cathode of Al line. (c) Enlarged cross-sectional SEM picture of the left-upper region in the anode of Al line.
Relationship between maximum temperature of bumps and resistance change of Al line. For a current density of , when the resistance of the Al line changed doubled, maximum temperature of the solder bump reached . For current density of , was reached when the resistance of the Al line increases by a factor of 3.
Experimental conditions of eutectic SnPb solder at .
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