No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Study of the thermal stress in a Pb-free half-bump solder joint under current stressing
1.S. Brandenburg and S. Yeh, SMI98 Proceedings of the Surface Mount International Conference and Exhibition, San Jose, CA, August 1998 (SMTA, Edina, MN), p. 337.
4.H. Ye, C. Basaran, and D. C. Hopkins, Int. J. Solids Struct. 41, 4939 (2004).
7.T. Siewert, S. Liu, D. R. Smith, and J. C. Madeni, Database for Solder Properties with Emphasis on New Lead-free Solders NIST and Colorado School of Mines, 2002.
8.T. O. Reinikainen, P. Marjadi, and J. K. Kivilahti, Proceedings of the Sixth International Conference of EuroSIME, Berlin, Germany, April 2005, p. 91.
10.X. Yu and K. Weide, Proc. SPIE 3216, 160 (1997).
Article metrics loading...
Full text loading...
Most read this month