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(Color online) Schematic diagram of the half-bump sample. (a) Cured in the epoxy. (b) A half-bump solder joint.
(Color online) Temperature and thermal stress distribution in the bump. (a) Temperature distribution. (b) Stress distribution.
(Color online) Thermal stress distribution in the layer. (a) Stress distribution. (b) Variation of the stress with the distance from point A in direction .
(Color online) Morphological evolution of the solder joint. (a) . (b) . (c) .
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