1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects
Rent:
Rent this article for
USD
10.1063/1.2437689
/content/aip/journal/apl/90/5/10.1063/1.2437689
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/5/10.1063/1.2437689
/content/aip/journal/apl/90/5/10.1063/1.2437689
Loading

Data & Media loading...

Loading

Article metrics loading...

/content/aip/journal/apl/90/5/10.1063/1.2437689
2007-01-30
2014-12-19
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/5/10.1063/1.2437689
10.1063/1.2437689
SEARCH_EXPAND_ITEM