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Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects
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10.1063/1.2437689
/content/aip/journal/apl/90/5/10.1063/1.2437689
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/5/10.1063/1.2437689
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic structure of FIB cross-sectional observations and Monte Carlo simulation region in the lower layer of the Cu line.

Image of FIG. 2.
FIG. 2.

Transversal FIB images of EM-induced voiding at the Cu/cap/liner interface.

Image of FIG. 3.
FIG. 3.

Transversal TEM image of EM voiding at Cu/cap/liner interface.

Image of FIG. 4.
FIG. 4.

Simulation of vacancy and void evolution process. (a) Plan-view observation. (b) Cross-sectional observation.

Image of FIG. 5.
FIG. 5.

(Color online) Illustration of vacancy collection and void migration towards Cu/cap/liner edge.

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/content/aip/journal/apl/90/5/10.1063/1.2437689
2007-01-30
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/90/5/10.1063/1.2437689
10.1063/1.2437689
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