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Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
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10.1063/1.2790376
/content/aip/journal/apl/91/13/10.1063/1.2790376
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/13/10.1063/1.2790376
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Voltage distribution in the solder joint with a Kelvin structure. The possible positions for the voltage probe on the chip side are also shown in the figure, including 0°, 45°, 90°, and 180°. (b) The voltage profile along the arc on the chip side. (c) The voltage profile along the arc on the substrate side.

Image of FIG. 2.
FIG. 2.

The cross-sectional view for five of the simulation models. The depletion percentage of the UBM opening is (a) 0%, (b) 6%, (c) 50%, and (d) 75%.

Image of FIG. 3.
FIG. 3.

(a) The increase in voltage as a function of depletion percentage of UBM opening with the four different positions of voltage probe on the chip side. (b) Percentage increase in bump resistance vs depletion percentage of UBM opening for the four layouts. (c) Enlarged illustration for Fig. 2(b) within 22% increase in bump resistance.

Image of FIG. 4.
FIG. 4.

(a) Cross-sectional SEM image for a SnPb bump after being stressed by at for . (b) The corresponding change in resistance as a function of stressing time.

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/content/aip/journal/apl/91/13/10.1063/1.2790376
2007-09-28
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/13/10.1063/1.2790376
10.1063/1.2790376
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