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Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
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10.1063/1.2790376
/content/aip/journal/apl/91/13/10.1063/1.2790376
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/13/10.1063/1.2790376
/content/aip/journal/apl/91/13/10.1063/1.2790376
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/content/aip/journal/apl/91/13/10.1063/1.2790376
2007-09-28
2014-12-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/13/10.1063/1.2790376
10.1063/1.2790376
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