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Investigation on the diffusion barrier properties of sputtered thin films in Cu interconnects
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10.1063/1.2800382
/content/aip/journal/apl/91/16/10.1063/1.2800382
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/16/10.1063/1.2800382
/content/aip/journal/apl/91/16/10.1063/1.2800382
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/content/aip/journal/apl/91/16/10.1063/1.2800382
2007-10-18
2015-02-01
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Investigation on the diffusion barrier properties of sputtered Mo∕W–N thin films in Cu interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/16/10.1063/1.2800382
10.1063/1.2800382
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