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(Color online) Design and fabrication steps of an ultrathin flexible light plate on a parylene template using a combination of self-alignment and lift-off techniques.
(Color online) Step coverage of LED bare chip planarized by negative photoresist examined by scanning electron microscopy: Effects of various exposure conditions (a) normal and (b) 150% higher dosage were demonstrated.
(Color online) Photograph of ultrathin light plate attached to a plastic sheet. Each InGaN LED chip is driven at .
(Color online) (a) Normalized ITO resistance change as a function of bending radius under various photoresist overcoat thicknesses (5, 10, 15, and ). (b) Electroluminescence spectra taken from ultrathin light plate after 1000-time cyclic test under various bending radii (1.5, 1, and ). The inset shows current-voltage characteristics of each InGaN LED chip driven at after 1000-time bending test.
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