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Nondestructive electrical characterization of integrated interconnect line-to-line spacing for advanced semiconductor chips
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10.1063/1.2806916
/content/aip/journal/apl/91/19/10.1063/1.2806916
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/19/10.1063/1.2806916
/content/aip/journal/apl/91/19/10.1063/1.2806916
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/content/aip/journal/apl/91/19/10.1063/1.2806916
2007-11-08
2014-08-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Nondestructive electrical characterization of integrated interconnect line-to-line spacing for advanced semiconductor chips
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/19/10.1063/1.2806916
10.1063/1.2806916
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