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Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at
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10.1063/1.2756292
/content/aip/journal/apl/91/2/10.1063/1.2756292
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/2/10.1063/1.2756292
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Eutectic SnPb solder joint that was current stressed with for at . (a) Backscattered electron image, (b) x-ray fluorescence emission of , and (c) x-ray fluorescence emission of .

Image of FIG. 2.
FIG. 2.

Integrated average of fluorescence emission intensities over entire width in Fig. 1 plotted as a function of distance from the cathode: (a) and (b) .

Image of FIG. 3.
FIG. 3.

Integrated average of fluorescence emission intensities of over entire width plotted as a function of distance from the cathode: (a) after of current stressing and (b) after of current stressing.

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/content/aip/journal/apl/91/2/10.1063/1.2756292
2007-07-10
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150°C
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/2/10.1063/1.2756292
10.1063/1.2756292
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