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Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition
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10.1063/1.2825412
/content/aip/journal/apl/91/25/10.1063/1.2825412
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/25/10.1063/1.2825412

Figures

Image of FIG. 1.
FIG. 1.

(Color online) Illustration of the nanotwinned structure used in the present work, obtained by repetition of the Cu-twinned supercell.

Image of FIG. 2.
FIG. 2.

(Color online) The total energy of FCC Cu and nanotwinned Cu as a function of strain in (a) the {111} plane and (b) the {112} plane.

Tables

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Table I.

Comparison of twin fault energies obtained by different methods.

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/content/aip/journal/apl/91/25/10.1063/1.2825412
2007-12-18
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition
http://aip.metastore.ingenta.com/content/aip/journal/apl/91/25/10.1063/1.2825412
10.1063/1.2825412
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