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Cascade single-chip phosphor-free white light-emitting diodes
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10.1063/1.2830991
/content/aip/journal/apl/92/1/10.1063/1.2830991
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/1/10.1063/1.2830991
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The schematic structure and the band diagram of the CSCPF white LEDs in a flip-chip package. Such white LED is composed of one AlGaInP LED and one GaN LED integrated by direct wafer-bonding technology. The mixed lights from the two active regions show white color to peoples’ eyes.

Image of FIG. 2.
FIG. 2.

TEM result of the bonding interface. The top material is GaN and the down one is GaAs with about -thick bright layer sandwiched in between. No cavities are observed in the bonding interface.

Image of FIG. 3.
FIG. 3.

The curves of the CSCPF white LEDs, and unbonded AlGaInP and InGaN LEDs. At , the voltages are 10.6, 2.2, and , respectively. The voltage dropped on the bonding interface at about .

Image of FIG. 4.
FIG. 4.

The RT EL spectra of the CSCPF white LED and unbonded GaN and AlGaInP LEDs. The inset was the CIE chromaticity coordinates of these white LEDs at near (0.3, 0.3) on the chromaticity diagram.

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/content/aip/journal/apl/92/1/10.1063/1.2830991
2008-01-04
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Cascade single-chip phosphor-free white light-emitting diodes
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/1/10.1063/1.2830991
10.1063/1.2830991
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