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Buckling behavior of metal film/substrate structure under pure bending
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10.1063/1.2897035
/content/aip/journal/apl/92/13/10.1063/1.2897035
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/13/10.1063/1.2897035
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic depiction of four-point bending test.

Image of FIG. 2.
FIG. 2.

The top view of the central part of well bonded Cu film on Cu substrate after the tensile strain arrival to 21.8%.

Image of FIG. 3.
FIG. 3.

The top view of the edge part of well bonded Cu film on Cu substrate after the tensile strain arrival to 21.8%.

Image of FIG. 4.
FIG. 4.

The micrograph of the buckling related delamination at the lateral edge of the Cu film.

Image of FIG. 5.
FIG. 5.

Schematic depictions of shrink strain induced buckling of the Cu film, (a) top view and (b) side view.

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/content/aip/journal/apl/92/13/10.1063/1.2897035
2008-03-31
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Buckling behavior of metal film/substrate structure under pure bending
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/13/10.1063/1.2897035
10.1063/1.2897035
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