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Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
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10.1063/1.2953692
/content/aip/journal/apl/92/26/10.1063/1.2953692
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/26/10.1063/1.2953692
/content/aip/journal/apl/92/26/10.1063/1.2953692
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/content/aip/journal/apl/92/26/10.1063/1.2953692
2008-07-01
2014-12-22
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/26/10.1063/1.2953692
10.1063/1.2953692
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