1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
Rent:
Rent this article for
USD
10.1063/1.2953692
/content/aip/journal/apl/92/26/10.1063/1.2953692
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/26/10.1063/1.2953692
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Lead-free flip chip solder joint with copper column (a) type 1, (b) type 2, and (c) electromigration setup.

Image of FIG. 2.
FIG. 2.

IMC growth in copper column solder with and without current stressing. [(a)–(c)] Unpowered bumps 100, 500, and . Current stressing after 100, 500, and , with electrons from top to bottom.

Image of FIG. 3.
FIG. 3.

Impact failure for flip chip solder joint having a high fraction of IMC.

Image of FIG. 4.
FIG. 4.

Formation of voids in copper column solder joint after electromigration at current density of . [(a) and (b)] type 1 and [(c) and (d)] type 2.

Loading

Article metrics loading...

/content/aip/journal/apl/92/26/10.1063/1.2953692
2008-07-01
2014-04-24
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/26/10.1063/1.2953692
10.1063/1.2953692
SEARCH_EXPAND_ITEM