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Write and erase mechanisms for bulk metallic glass
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View: Figures


Image of FIG. 1.
FIG. 1.

SEM image of pyramid-shaped microfeatures on the surface of BMG. The features are transferred from BMG by TPF at for under a pressure of .

Image of FIG. 2.
FIG. 2.

SEM images of two different microfeatures after annealing at for 60, 300, and . The feature is completely erased after , whereas the height of the large feature is significantly reduced.

Image of FIG. 3.
FIG. 3.

Measured heights with increasing annealing time for three differently sized microfeatures. The dashed lines are the fitting curves obtained using Eq. (5). The results are well fitted by the exponential decay expression. The inset shows the schematic illustration of the change in height of a hypothetical feature upon annealing in the SCLR. The initial height decreases to after annealing for .

Image of FIG. 4.
FIG. 4.

(a) SEM image of surface roughness on the BMG transferred from a Si die during TPF. (b) SEM image showing the surface smoothened by annealing at for .


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Write and erase mechanisms for bulk metallic glass