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A general approach for fabrication of superhydrophobic and superamphiphobic surfaces
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10.1063/1.2839403
/content/aip/journal/apl/92/5/10.1063/1.2839403
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/5/10.1063/1.2839403
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The SEM images of superhydrophobic surfaces constructed on copper wafer by the electrodeposition process. The reaction times are (a) 1, (b) 2.3, and (c) 3. (d) Digital photograph of water droplet on superhydrophobic surface (take copper as an example). The bars represent .

Image of FIG. 2.
FIG. 2.

(a) FTIR spectra of -tetradecanoic acid (1) and (2) powders scraped from the prepared surface. (b) and (c) are XPS spectra and C pecks of the as-prepared surface, respectively. (d) is the XRD spectrum of powders scraped from the prepared surface. Cathode and anode are all copper.

Image of FIG. 3.
FIG. 3.

The relationship between values (a) and concentration of the solutions of NaCl, (inner graph) (b) with contact angle of the prepared superhydrophobic surface.

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/content/aip/journal/apl/92/5/10.1063/1.2839403
2008-02-05
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: A general approach for fabrication of superhydrophobic and superamphiphobic surfaces
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/5/10.1063/1.2839403
10.1063/1.2839403
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