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Mechanical stress impact on thin film thermodynamic properties
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10.1063/1.2841636
/content/aip/journal/apl/92/5/10.1063/1.2841636
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/5/10.1063/1.2841636
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Relative resistance-pressure isotherms for films (A and B: and C: ) on Si substrate (▴, A second loading; ◼, B second loading; ●, C first loading; and ★ C second loading). The isotherms differ strongly. Images of the related microstructures are inserted.

Image of FIG. 2.
FIG. 2.

First (◼) and second (●) loading cycles of on Si. For the first loading cycle, the measured relative resistance value jumps to 1.5 when the formerly bound film completely detaches from the substrate. For the second loading cycle, the hysteresis area is small.

Image of FIG. 3.
FIG. 3.

Second (◼) and third (●) gas loading cycles of on Si (D) compared to the values calculated for a quasifree, glue framed electrochemical loaded film E (▴). Both films show bulklike behavior.

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/content/aip/journal/apl/92/5/10.1063/1.2841636
2008-02-08
2014-04-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Mechanical stress impact on thin Pd1−xFex film thermodynamic properties
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/5/10.1063/1.2841636
10.1063/1.2841636
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