1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
Rent:
Rent this article for
USD
10.1063/1.2870014
/content/aip/journal/apl/92/8/10.1063/1.2870014
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/8/10.1063/1.2870014
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Tensile engineering stress-strain curves of the and Cu samples: the open squares mark the uniform elongations and the open circles mark the 0.2% offset yield strengths. (b) Normalized strain-hardening rate against the true strain. The inset shows curves of against true stress.

Image of FIG. 2.
FIG. 2.

Typical bright-field TEM images for the (a) Cu and (b) Cu samples. It is apparent that the grain boundaries in the sample are wavy and diffuse, while the grain boundaries in the sample are sharper and straighter than in the sample.

Image of FIG. 3.
FIG. 3.

The distribution of grain boundary misorientation angles for the and samples measured by EBSD with scanning step sizes of 70, 100, or .

Loading

Article metrics loading...

/content/aip/journal/apl/92/8/10.1063/1.2870014
2008-02-25
2014-04-17
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
http://aip.metastore.ingenta.com/content/aip/journal/apl/92/8/10.1063/1.2870014
10.1063/1.2870014
SEARCH_EXPAND_ITEM