Full text loading...
Scanning electron microscopy images of several Sn whiskers showing different growth morphologies.
FIB-cross-sectional micrographs of as-deposited and postbaked specimens taken about eight months after Sn deposition. The as-deposited specimen (see image on top) exhibits a very irregular formation along the Sn grain boundaries starting at the interface. The dotted line (see image at bottom) indicates the rather flat intermetallic compound layer present directly after postbake treatment. Upon long-time aging at ambient temperature of the postbaked specimen further modest growth of (see solid line in image at bottom) occurred along the Sn grain boundaries.
Near-surface stress-depth profiles in real space derived from the as measured stress-depth profiles in Laplace space, for as-deposited and postbaked specimens for aging times at ambient temperature of one day (i.e., before the onset of whisker formation for the as-deposited specimen) and of about eight months (i.e., during whisker growth for the as-deposited specimen).
Article metrics loading...