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Improved contact for thermal and electrical transport in carbon nanofiber interconnects
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10.1063/1.2979710
/content/aip/journal/apl/93/10/10.1063/1.2979710
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/10/10.1063/1.2979710
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Current-stressing experiments: (a) CNF suspended on gold electrodes; (b) CNF supported by substrate; (c) CNF suspended over substrate with W deposited on contacts; and (d) CNF supported by substrate with W deposited on contacts. Upper figures show SEM image of a CNF device at 75° tilted-angle view, and lower figures illustrate schematic of electrical measurement setup for current-stressing experiments.

Image of FIG. 2.
FIG. 2.

(a) Typical characteristics with configuration (1) measured before high-current stress. (b) Typical characteristics with configuration (4) measured before high-current stress.

Image of FIG. 3.
FIG. 3.

Maximum current density as a function of reciprocal CNF length for 36 devices. Solid circles indicate the results for configuration (1), open circles for configuration (2), solid triangles for configuration (3), and open triangles for configuration (4). The solid line shows a linear fit for suspended CNFs, as predicted by our heat transport model (Ref. 14).

Image of FIG. 4.
FIG. 4.

(a) Resistance of CNF devices without W deposition as a function of annealing current after each annealing cycle. (b) Resistance of CNF devices with W deposition as a function of annealing current after each annealing cycle.

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/content/aip/journal/apl/93/10/10.1063/1.2979710
2008-09-10
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Improved contact for thermal and electrical transport in carbon nanofiber interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/10/10.1063/1.2979710
10.1063/1.2979710
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