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SEM images of films deposited at . (a) On unmodified glass for . (b) On silanized glass for . [(c)–(e)] On silanized glass for . (d) and (e) are cross-sectional images using secondary electron and backscattered electron, respectively.
(a) Typical transmittance spectra (the inset), and the values at for various deposition times and temperatures. Film thickness is estimated by the spectra method. (b) Deposition-time dependency of sheet resistance and transparency. The inset is the reciprocal of sheet resistance vs deposition time.
TEM images of the CuS film deposited at for . (a) Overall view of the film containing layer and islands. (b) ED pattern of the layer with a horizontally oriented grain and a vertically oriented grain, as schemed in the inset.
Output performance of the -based DSSC, where the as-assembled films were deposited at for .
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