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Toward the existence of ultrafast diffusion paths in Cu with a gradient microstructure: Room temperature diffusion of Ni
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10.1063/1.2992628
/content/aip/journal/apl/93/13/10.1063/1.2992628
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/13/10.1063/1.2992628

Figures

Image of FIG. 1.
FIG. 1.

The penetration profiles for diffusion in SMAT-prepared Cu (samples A, B, C, and D), in comparison with the coarse-grained counterpart (sample O). is the penetration depth.

Image of FIG. 2.
FIG. 2.

(a) A schematic illustration of the gradient microstructure in the SMAT Cu surface layer. Region I is composed of grains formed from twins dividing the cells formed by dislocation activities (the cell size is and the grain size is ); region III is composed of grains formed by dislocations activities; and region II is a transition from III to I. (b) The penetration profiles (Fig. 1) replotted by choosing the origin according to the specific microstructure region that allows direct determination of the effective diffusivities, see Eqs. (1a), (1b), (2a), and (2b).

Tables

Generic image for table
Table I.

Diffusivities of in different SMAT Cu samples at room temperature . The experimental uncertainties of the measured diffusion coefficients are less than .

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/content/aip/journal/apl/93/13/10.1063/1.2992628
2008-09-29
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Toward the existence of ultrafast diffusion paths in Cu with a gradient microstructure: Room temperature diffusion of Ni
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/13/10.1063/1.2992628
10.1063/1.2992628
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