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Reduction of thermal conductivity in wafer-bonded silicon
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10.1063/1.2959063
/content/aip/journal/apl/93/2/10.1063/1.2959063
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/2/10.1063/1.2959063

Figures

Image of FIG. 1.
FIG. 1.

Schematic cross-sectional view of an idealized bonded wafer stack (a) and the unit-cell modeling of its thermal conductivity [(b) and (c)].

Image of FIG. 2.
FIG. 2.

(a) Experimentally measured thermal conductivity values of three wafer-bonded samples. Also plotted is the measured thermal conductivity of an ordinary homogeneous bulk silicon sample. (b) Expanded scale of (a) showing measured low thermal conductivity of two wafer-bonded samples. Also plotted is the thermal conductivity of bulk silicon divided by 50.

Image of FIG. 3.
FIG. 3.

Modeled effective thermal conductivity of wafer-bonded silicon for one set of bonding parameters and several air-gap thicknesses. The bottom curve is for conduction through the contacting dots only.

Tables

Generic image for table
Table I.

Summary of the experimental runs

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/content/aip/journal/apl/93/2/10.1063/1.2959063
2008-07-18
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Reduction of thermal conductivity in wafer-bonded silicon
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/2/10.1063/1.2959063
10.1063/1.2959063
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