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Schematic cross-sectional view of an idealized bonded wafer stack (a) and the unit-cell modeling of its thermal conductivity [(b) and (c)].
(a) Experimentally measured thermal conductivity values of three wafer-bonded samples. Also plotted is the measured thermal conductivity of an ordinary homogeneous bulk silicon sample. (b) Expanded scale of (a) showing measured low thermal conductivity of two wafer-bonded samples. Also plotted is the thermal conductivity of bulk silicon divided by 50.
Modeled effective thermal conductivity of wafer-bonded silicon for one set of bonding parameters and several air-gap thicknesses. The bottom curve is for conduction through the contacting dots only.
Summary of the experimental runs
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