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The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
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10.1063/1.2963473
/content/aip/journal/apl/93/4/10.1063/1.2963473
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/4/10.1063/1.2963473
/content/aip/journal/apl/93/4/10.1063/1.2963473
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/content/aip/journal/apl/93/4/10.1063/1.2963473
2008-07-30
2014-07-29
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/4/10.1063/1.2963473
10.1063/1.2963473
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