Full text loading...
Position of the LTEM among other nondestructive LSIC testing methods.
(a) Experimental setup of LTEM for LSIC inspection. (b) The laser reflection image of the Si-MOSFET chip. The test circuits circled in white have lines damaged by cutting them by FIB. (c) Schematic of the -MOSFET circuit structure indicated by the white circles in (b). (d) A cross section of the -MOSFET circuit in (c).
Comparison of the terahertz emission images and waveforms between a normal chip and a defective one: [(a) and (b)] the terahertz emission images from the normal chip and the defective one, respectively. White and black areas show positive and negative amplitude of terahertz emissions from junctions surrounded by four electrode pads each. The white arrows indicate three damaged MOSFET circuits in the defective chip; [(c) and (d)] the terahertz emission waveforms from the normal chip and the defective one, respectively.
Article metrics loading...