1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate
Rent:
Rent this article for
USD
10.1063/1.2973148
/content/aip/journal/apl/93/6/10.1063/1.2973148
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/6/10.1063/1.2973148
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

TEM micrograph of the interfacial microstructure of a Cu/pure Sn specimen.

Image of FIG. 2.
FIG. 2.

TEM micrograph of the interfacial microstructure of a u specimen, (b)High-resolution TEM) diffraction pattern of at point 1, (c) diffraction pattern of at point 2, and (d) diffraction pattern of Cu at point 3.

Image of FIG. 3.
FIG. 3.

(a) Image at the interfacial area of a u specimen adjacent to the Cu side. (b) (c) are, respectively, the enlarged images taken from regions 1 and 2, and the diffraction pattern from region 2.

Loading

Article metrics loading...

/content/aip/journal/apl/93/6/10.1063/1.2973148
2008-08-15
2014-04-23
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/6/10.1063/1.2973148
10.1063/1.2973148
SEARCH_EXPAND_ITEM