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The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate
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10.1063/1.2973148
/content/aip/journal/apl/93/6/10.1063/1.2973148
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/6/10.1063/1.2973148
/content/aip/journal/apl/93/6/10.1063/1.2973148
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/content/aip/journal/apl/93/6/10.1063/1.2973148
2008-08-15
2014-10-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/6/10.1063/1.2973148
10.1063/1.2973148
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