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A planar layer configuration for surface plasmon interference nanoscale lithography
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10.1063/1.2976630
/content/aip/journal/apl/93/9/10.1063/1.2976630
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/9/10.1063/1.2976630
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic diagram of the planar layer configuration.

Image of FIG. 2.
FIG. 2.

Reflectance vs incident angle of dielectric layer coated with silver film.

Image of FIG. 3.
FIG. 3.

Electric field distribution of the interference pattern generated by the field components (a) and (b) on the photoresist layer.

Image of FIG. 4.
FIG. 4.

Normalized intensities of the electric field components as a function of the decay direction from the origin.

Image of FIG. 5.
FIG. 5.

Intensity contrast as a function of decay length from the origin.

Image of FIG. 6.
FIG. 6.

Normalized intensities of the electric field components as a function of dielectric and metal layer thickness at .

Image of FIG. 7.
FIG. 7.

Resist profile cross section at exposure times, (a) and (b) .

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/content/aip/journal/apl/93/9/10.1063/1.2976630
2008-09-03
2014-04-16
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: A planar layer configuration for surface plasmon interference nanoscale lithography
http://aip.metastore.ingenta.com/content/aip/journal/apl/93/9/10.1063/1.2976630
10.1063/1.2976630
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