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Mechanical and electrical evaluation of parylene- encapsulated carbon nanotube networks on a flexible substrate
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View: Figures


Image of FIG. 1.
FIG. 1.

(a) Optical photograph of the flexible SWNT network. (b) Fabrication sequence starts by (1) depositing a parylene- layer onto silicon substrate, (2) sputtering a thin layer of metal (Au) onto the parylene- layer, (3) drop casting an aqueous solution of SWNTs onto the parylene layer, (4) depositing the top parylene- layer to encapsulate the network, (5) opening contact areas over the Au electrodes, and (6) peeling off the flexible network from the silicon substrate.

Image of FIG. 2.
FIG. 2.

(a) Scanning electron microscopy micrograph of the SWNTs deposited on the parylene- substrate. (b) The dimensions of the tested sample with a test area of . (c) Strain distribution in the test specimen by FEA. This particular dog bone design ensured that the normal strain was confined to the test area.

Image of FIG. 3.
FIG. 3.

(a) The normal stress vs strain from the tensile testing of the encapsulated SWNT network on the parylene- substrate with a strain rate of 0.2 mm/min. The proportional strain limit was measured to be 2.8%. (b) Measured change in resistance (normalized to initial resistance) vs strain. The details of 0%–3% strain range are magnified in the inset. (c) Normal stress vs normal strain and the measured change in resistance (normalized to initial resistance) vs normal strain after the first, 50th, and 99th loading cycles.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Mechanical and electrical evaluation of parylene-C encapsulated carbon nanotube networks on a flexible substrate