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The etch rates of films as a function of gas mixtures (a) and rf power (b). The data in panel (a) were collected using an rf power of 160 W.
Top-view SEM image of the patterned film array consisting of diameter pillars at a center-to-center spacing (a). Film was etched using an optimal gas mixture and rf power. Side-view SEM image of the same sample (b). An expanded view of one pillar consisting of a cylinder with height to diameter aspect ratio of 0.2 having a photoresist cap on the surface (c). The “frost” on the element is a thin PtPd coating used to reduce fluorescence during SEM imaging. Top view SEM image of a test pattern designed to evaluate minimum lateral features (d). An expanded view of the minimal lateral feature of (at the necked region) (e).
Hysteresis loops, as normalized magnetization vs applied magnetic field in Oe, for the as-deposited film sample (solid line) and etched film after annealing (dashed line). The lines correspond to the slope of the loops as they pass through remanence and qualitatively reflect the sample's demagnetizing energies.
Demagnetizing fields , coercive fields , and demagnetizing factors of as-deposited film, after etching, and after etching followed by a heat treatment. Note: represents percent change from as-deposited condition. was approximated using the oblate ellipsoid model, , where represents aspect ratio of pillar.
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