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Residual stress analysis in chemical-vapor-deposition diamond films
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10.1063/1.3139083
/content/aip/journal/apl/94/20/10.1063/1.3139083
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/20/10.1063/1.3139083

Figures

Image of FIG. 1.
FIG. 1.

distribution of the {111} diffraction line of the thick diamond film on the WC substrate. Region I: (-penetration depth; -film thickness). Region II: .

Image of FIG. 2.
FIG. 2.

(a) Residual stresses as a function of the distance from the growth fronts and (b) volume average residual stresses for three different ratios of methane to hydrogen in the feeding admixture gas (identical Mo substrates, film thickness ).

Image of FIG. 3.
FIG. 3.

(a) Residual stresses as a function of distance from the growth fronts and (b) volume average residual stresses at three different substrates [identical , film thicknesses (graphite), (Mo), and (WC)].

Image of FIG. 4.
FIG. 4.

(a) Residual stresses as a function of distance from the growth fronts and (b) volume average residual stresses in three films with different thicknesses (identical , Mo substrate).

Tables

Generic image for table
Table I.

Deposition parameters for the three groups of diamond films (parameter variations are printed bold).

Generic image for table
Table II.

Young’s modulus; Poisson’s ratio; thermal expansion coefficients; calculated and measured thermal stresses between diamond films and substrates (mean values).

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/content/aip/journal/apl/94/20/10.1063/1.3139083
2009-05-20
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Residual stress analysis in chemical-vapor-deposition diamond films
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/20/10.1063/1.3139083
10.1063/1.3139083
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