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Longitudinal temperature distributions of both EE- and VLS-SiNWs in contact with one silicon island. Here the thermal conductivity of EE-SiNW is taken as and thermal conductivity of VLS-SiNW is . (a) Temperature distribution for EE-SiNW with applied current . (b) Temperature distribution for VLS-SiNW with applied current . (c) Temperature distribution for VLS-SiNW with applied current . (d) Temperature profiles for both EE- and VLS-SiNW with applied current .
Dependences of cooling temperature on thermal conductivity and applied electrical current. The symbols are finite element simulation results and the curves are predictions from Eq. (3).
Cooling temperature vs heat load power density for EE- and VLS-SiNWs calculated with finite element method. The applied electrical current is . The solid curves are drawn to guide the eyes.
(a) Size effect on thermal conductivity. The experimental thermal conductivity values are from Ref. 5 and the solid curve is a prediction from Eq. (4) (from Ref. 21). (b) Cooling temperature vs electrical current for SiNWs with different diameters. (c) Maximum cooling temperature vs diameter of SiNW.
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