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Thermal conductivity of bismuth telluride nanowire array-epoxy composite
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10.1063/1.3143221
/content/aip/journal/apl/94/22/10.1063/1.3143221
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/22/10.1063/1.3143221

Figures

Image of FIG. 1.
FIG. 1.

(a) FESEM image showing the pristine fractured cross section of an as-grown nanowire array/PAA composite. (b) A magnified view of the composite cross section that shows that the crack through the interface between the PAA and the nanowire rather than through the nanowire, in contrast to the observed behavior of cracks in the nanowire/SU-8 composite [Figs. 2(a) and 2(b) ].

Image of FIG. 2.
FIG. 2.

(a) FESEM image showing the pristine fractured cross section of a nanowire array/SU-8 composite. The nanowires are embedded in the SU-8 epoxy matrix confirming complete infiltration of the epoxy. (b) A magnified view of the composite cross-section that shows that the fracture plane propagates through the nanowire—exposing crystallographic cleavage planes in —and not through the interface between the nanowire and the SU-8 epoxy.

Tables

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Table I.

SU-8 processing steps and optimized baking time for nanowire array infiltration.

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/content/aip/journal/apl/94/22/10.1063/1.3143221
2009-06-04
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal conductivity of bismuth telluride nanowire array-epoxy composite
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/22/10.1063/1.3143221
10.1063/1.3143221
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