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Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint
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10.1063/1.3167358
/content/aip/journal/apl/94/26/10.1063/1.3167358
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/26/10.1063/1.3167358
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Typical load-displacement curves obtained from tapered double cantilever tests for a control sample without treatment (Cu/epoxy interface) and a sample prepared with SAM treatment on the copper substrate (Cu/SAM/epoxy interface).

Image of FIG. 2.
FIG. 2.

Surface morphology of copper substrates in different treatments. (a) and (c) A control substrate without treatment, (b) and (d) a substrate under the SAM treatment.

Image of FIG. 3.
FIG. 3.

Morphological images of fracture surfaces of a sample treated with thiols. (a) Copper side and (b) epoxy side in treated region. (c) Boundary in between untreated and treated regions on copper side.

Image of FIG. 4.
FIG. 4.

Root-mean-square roughness of (a) a control and (b) a SAM treated substrate.

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/content/aip/journal/apl/94/26/10.1063/1.3167358
2009-06-30
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/26/10.1063/1.3167358
10.1063/1.3167358
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