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Typical load-displacement curves obtained from tapered double cantilever tests for a control sample without treatment (Cu/epoxy interface) and a sample prepared with SAM treatment on the copper substrate (Cu/SAM/epoxy interface).
Surface morphology of copper substrates in different treatments. (a) and (c) A control substrate without treatment, (b) and (d) a substrate under the SAM treatment.
Morphological images of fracture surfaces of a sample treated with thiols. (a) Copper side and (b) epoxy side in treated region. (c) Boundary in between untreated and treated regions on copper side.
Root-mean-square roughness of (a) a control and (b) a SAM treated substrate.
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