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Enhancement of transverse thermoelectric power factor in tilted Bi/Cu multilayer
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10.1063/1.3081411
/content/aip/journal/apl/94/6/10.1063/1.3081411
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/6/10.1063/1.3081411

Figures

Image of FIG. 1.
FIG. 1.

(a) A schematic view of tilted Bi/Cu multilayer and (b) a contour plot of transverse obtained from the equivalent circuit model.

Image of FIG. 2.
FIG. 2.

(a) Temperature and (b) voltage distributions and (c) line profiles at obtained from the finite element analysis. For comparison, voltage derived from the equivalent circuit model is plotted with a dashed line in (c). (d) Current-voltage and power-voltage characteristics obtained from the finite element analysis.

Image of FIG. 3.
FIG. 3.

(a) The fabricated sample and (b) normalized transverse thermoelectric voltage as a function of applied temperature difference . The dashed line is a projection from the equivalent circuit model.

Tables

Generic image for table
Table I.

Thermoelectric parameters of constituent materials.

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/content/aip/journal/apl/94/6/10.1063/1.3081411
2009-02-13
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Enhancement of transverse thermoelectric power factor in tilted Bi/Cu multilayer
http://aip.metastore.ingenta.com/content/aip/journal/apl/94/6/10.1063/1.3081411
10.1063/1.3081411
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