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[(a)–(d)] Defect selective passivation process flow.
[(a)–(c)] SEM image of the sample surface corresponding to the process step in Figs. 1(a)–1(c), respectively.
(a) TEM image of LED sample with defect selective passivation. (b) SEM image of the defect passivated sample after molten KOH etching. (c) SEM image of the defect passivated sample after high temperature etching.
[(a) and (b)] Cross section CL and SEM image of the defect passivated epi-wafer under same magnification. (c) L-I and V-I curve of the DP-LED and R-LED.
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