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Time dependent thermoelectric performance of a bundle of silicon nanowires for on-chip cooler applications
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10.1063/1.3273869
/content/aip/journal/apl/95/24/10.1063/1.3273869
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/24/10.1063/1.3273869
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The schematics of the cooling calculation model.

Image of FIG. 2.
FIG. 2.

(a) Time dependent temperature of the Si island for different applied electrical current. The temperature decreases with time exponentially: , here is the stationary-state temperature of the island, is the cooling temperature, is the environment temperature, is the response time. (b) Dependences of cooling response time on applied electrical current.

Image of FIG. 3.
FIG. 3.

(a) The time dependent temperature for different number of SiNWs . (b) The cooling response time for different number of SiNWs . Here the electrical current is .

Image of FIG. 4.
FIG. 4.

(a) Impact of unexpected high thermal conductivity of one SiNW in the -wire bundle on the cooling performance. is the unexpected high value of thermal conductivity. (b) Influence of one high thermal conductivity SiNW on the cooling temperature of the whole -wire bundle. This influence decreases with increasing of the number of SiNWs exponentially.

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/content/aip/journal/apl/95/24/10.1063/1.3273869
2009-12-14
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Time dependent thermoelectric performance of a bundle of silicon nanowires for on-chip cooler applications
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/24/10.1063/1.3273869
10.1063/1.3273869
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